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F2012,32.768KHZ晶振,F2012‐50‐9,2012mm,FCD-Tech晶振品〗牌产品特点∞：

微型陶瓷SMD晶振封装，2个焊盘（可回流）

温度范围-40/+85°C（工业应用）

薄厚度0.6mm，优异的老化特性

应用：无线、商用和工业设备【等应用.

F2012,F2012‐50‐9,2012mm,FCD-Tech晶振品牌 参数表

Parameter

min.

typ.

max.

Unit

Condi?on

Frequency

32.768

KHz

Vibra?on mode

XY‐cut

Frequency stability

Ini?al tolerance @25°C

±20, ±50

ppm

Opera?ng temperature range

‐40

+85

°C

Turnover temperature Parabolic curvature constant

25°C±5 °C ‐0.045x10‐6/°C2max.

Equivalent Series Resistance (ESR)

90K? max.

Load Capacitance (CL)

Standard: 12.5pF ( 9pF, 7pF op?onal)

Shunt Capacitance (Co)

2.0

pF

Drive Level

0.1

µW

Aging

±3

ppm

At 25°C, ?rst year

Insula?on Resistance

500

M?

@ 100Vdc

Enclosure (see drawing)(LxWxH)

2.0 x 1.2 x 0.6

mm

Packing

3000 pcs per reel

F2012,F2012‐50‐9,2012mm,FCD-Tech晶振品牌尺寸图